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MCM Packaging Alternatives for Automotive Electronics Comparing Fine Pitch, Ball Grid Array, and Polyimide Chip Carriers

著者名:
掲載資料名:
1995 International Conference on Multichip Modules : proceedings : 19-21 April 1995, Denver, Colorado
シリーズ名:
Proceedings of SPIE - the International Society for Optical Engineering
シリーズ巻号:
2575
発行年:
1995
開始ページ:
134
終了ページ:
139
総ページ数:
6
出版情報:
Bellingham, WA: Society of Photo-optical Instrumentation Engineers
ISSN:
0277786X
ISBN:
9780930815424 [0930815424]
言語:
英語
請求記号:
P63600/2575
資料種別:
国際会議録

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