Development of Fine Pad Pitch Wire Bonding Technology

Development of Fine Pad Pitch Wire Bonding Technology

著者名:

掲載資料名:

27th International Symposium on Microelectronics : 15-17 November 1994, Boston, Massachusetts

シリーズ名:

Proceedings of SPIE - the International Society for Optical Engineering

シリーズ巻号:

2369

発行年:

1994

開始ページ:

283

終了ページ:

288

総ページ数:

6

出版情報:

Bellingham, WA: Society of Photo-optical Instrumentation Engineers

ISSN:

0277786X

ISBN:

9780930815417 [0930815416]

言語:

英語

請求記号:

P63600/2369

資料種別:

国際会議録

詳細

TDL書誌ID:	ZA00057572
シリーズID:	PA00000029
会議名:	International Symposium on Microelectronics
回次:	27th
会議開催地:	Boston, MA, USA
会議開催年:	1994.11.15-1994.11.17
論文注記:	27th International Symposium on Microelectronics, November 15-17, 1994, Boston, MA, USA

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