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Laser Via Ablation Technology for MCMs Thin Film Packaging - Past, Present, and Future at IBM Microelectronics

著者名:
掲載資料名:
27th International Symposium on Microelectronics : 15-17 November 1994, Boston, Massachusetts
シリーズ名:
Proceedings of SPIE - the International Society for Optical Engineering
シリーズ巻号:
2369
発行年:
1994
開始ページ:
31
終了ページ:
41
総ページ数:
11
出版情報:
Bellingham, WA: Society of Photo-optical Instrumentation Engineers
ISSN:
0277786X
ISBN:
9780930815417 [0930815416]
言語:
英語
請求記号:
P63600/2369
資料種別:
国際会議録

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