Solidification of Sn-3Ag-0.5Cu and Sn-0.7Cu-0.05Ni Solders

Solidification of Sn-3Ag-0.5Cu and Sn-0.7Cu-0.05Ni Solders

著者名:

掲載資料名:

Advanced Materials Engineering and Technology IV : selected peer reviewed papers from the 2015 International Conference on Advanced Materials Engineering and Technology (ICAMET 2015), December 4-5, 2015, Kaohsiung,Taiwan

シリーズ名:

Materials science forum

シリーズ巻号:

857

発行年:

2016

開始ページ:

44

終了ページ:

48

総ページ数:

5

出版情報:

Aedermannsdorf, Switzerland: Trans Tech Publications

ISSN:

02555476

ISBN:

9783035710205 [3035710201]

言語:

英語

請求記号:

M23650 [v.857]

資料種別:

国際会議録

詳細

TDL書誌ID:	ZA00055305
シリーズID:	PA00000012
会議名:	International Conference on Advanced Materials Engineering and Technology - ICAMET 2015
回次:	2015
会議開催地:	Kaohsiung,Taiwan
会議開催年:	2015.12.04-2015.12.05
論文注記:	2015 International Conference on Advanced Materials Engineering and Technology (ICAMET 2015), December 4-5, 2015, Kaohsiung,Taiwan

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