Thermal Conductivity of Polyimide Resin-Based Composite with Cu Fibers

Thermal Conductivity of Polyimide Resin-Based Composite with Cu Fibers

著者名:

掲載資料名:

Functional and Functionally Structured Materials : Selected, peer reviewed papers from the Chinese Materials Conference 2015, July 10-14, 2015, Guiyang, China

シリーズ名:

Materials science forum

シリーズ巻号:

848

発行年:

2016

開始ページ:

43

終了ページ:

48

総ページ数:

6

出版情報:

Aedermannsdorf, Switzerland: Trans Tech Publications

ISSN:

02555476

ISBN:

9783038357605 [303835760X]

言語:

英語

請求記号:

M23650 [v.848]

資料種別:

国際会議録

詳細

TDL書誌ID:	ZA00054305
シリーズID:	PA00000012
会議名:	Chinese Materials Conference
回次:	2015
会議開催地:	Guiyang, China
会議開催年:	2015.07.10-2015.07.14
論文注記:	Chinese Materials Conference 2015, July 10-14, 2015, Guiyang, China

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