Effect of Complexing Agent in Ni-P Coating on Cu Substrate

Effect of Complexing Agent in Ni-P Coating on Cu Substrate

著者名:

掲載資料名:

International Conference on Functional Materials and Metallurgy (ICoFM 2014) : Selected, peer reviewed papers from the International Conference on Functional Materials and Metallurgy (ICoFM 2014), September 17-18, 2014, Pulau Pinang, Malaysia

シリーズ名:

Materials science forum

シリーズ巻号:

819

発行年:

2015

開始ページ:

97

終了ページ:

102

総ページ数:

6

出版情報:

Aedermannsdorf, Switzerland: Trans Tech Publications

ISSN:

02555476

言語:

英語

請求記号:

M23650

資料種別:

国際会議録

詳細

TDL書誌ID:	ZA00054283
シリーズID:	PA00000012
会議名:	International Conference on Functional Materials and Metallurgy (ICoFM 2014)
回次:	2014
会議開催地:	Pulau Pinang, Malaysia
会議開催年:	2014.09.17-2014.09.18
論文注記:	International Conference on Functional Materials and Metallurgy (ICoFM 2014), September 17-18, 2014, Pulau Pinang, Malaysia

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