Electronic Failure Analysis of Plate-Capacitors Bonding with Conductive Adhesives

Electronic Failure Analysis of Plate-Capacitors Bonding with Conductive Adhesives

著者名:

掲載資料名:

Structural Materials : Selected, peer reviewed papers from the 12th IUMRS International Conference on Advanced Materials (IUMRS-ICAM 2013), September 22 -28, 2013, Qingdao, China

シリーズ名:

Materials science forum

シリーズ巻号:

788

発行年:

2014

開始ページ:

569

終了ページ:

572

総ページ数:

4

出版情報:

Aedermannsdorf, Switzerland: Trans Tech Publications

ISSN:

02555476

言語:

英語

請求記号:

M23650

資料種別:

国際会議録

詳細

TDL書誌ID:	ZA00054258
シリーズID:	PA00000012
会議名:	IUMRS International Conference on Advanced Materials (IUMRS-ICAM 2013)
回次:	12th
会議開催地:	Qingdao, China
会議開催年:	2013.09.22-2013.09.28
論文注記:	12th IUMRS International Conference on Advanced Materials (IUMRS-ICAM 2013), September 22-28, 2013, Qingdao, China

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