Blank Cover Image

Effects of In/Ce to Sn-3.5Ag Lead-Free Solder on Microstructures and Properties

著者名:
掲載資料名:
Materials performance, modeling and simulation : selected peer reviewed papers from the Chinese Materials Congress 2012 (CMC 2012), July 13-18, 2012, Taiyuan, China
シリーズ名:
Materials science forum
シリーズ巻号:
749
発行年:
2013
開始ページ:
198
終了ページ:
204
総ページ数:
7
出版情報:
Aedermannsdorf, Switzerland: Trans Tech Publications
ISSN:
02555476
言語:
英語
請求記号:
M23650
資料種別:
国際会議録

類似資料:

1 国際会議録 Effect of Bi Addition on Microstructures, Properties and Interfacial Intermetallic Compound Growth of Low-Ag Sn-Cu Lead-Free Solder

Y. Wang, X.C. Zhao, Y. Liu, J.W. Cheng, H. Li

Trans Tech Publications
7 国際会議録 Effects of Strain Rate on Mechanical Properties and Microstructure of V-5Cr-5Ti Alloy

W.J. Hu, X.C. Huang, F.J. Zhang, J. Mei, Y.X. Yan

Trans Tech Publications
2 国際会議録 Effect of Ag Addition on Growth of the Interfacial Intermetallic Compounds between Sn-0.7Cu Solder and Cu Substrate

X.C. Xie, X.C. Zhao, Y. Liu, J.W. Cheng, B. Zheng

Trans Tech Publications
8 国際会議録 Effects of La Doping on Microstructure and Ferroelectric Properties of BLTN Lead-Free Ceramics

N.N. Shao, X.Y. He, D.Z. Sun, B. Xia, X. Zeng, W.X. Cheng, P.S. Qiu, Y.B. Pan

Trans Tech Publications
3 国際会議録 Nickel Nanoparticles Mediated Growth of the Intermetallic Compound between Sn-1.0Ag-Xni Solders Alloy and Cu Substrate

X.C. Zhang, J.W. Cheng, B. Zheng, X.C. Zhao, Y. Liu

Trans Tech Publications
9 国際会議録 Effects of Hot Pressing and Deforming on the Microstructure and Properties of NdFeB Magnets

C.H. Li, F. Li, D.M. Chen, J.L. Zhao, Y.L. Ma

Trans Tech Publications
4 国際会議録 The Study on the Reducing Friction and Anti-Wear Performance of Zinc Phosphate Nanoparticles as Lubrication Additives

Y.X. Lv, X.C. Zhao, J.W. Cheng, Y. Liu, H. Li

Trans Tech Publications
10 国際会議録 Effects of Different Sr Additions on As Cast Microstructure and Tensile Properties of AS31 Alloy

J.X. Zhou, D.Q. Zhao, J.W. Wang, S.Q. Tang, W.H. Li

Trans Tech Publications
5 国際会議録 Effects of Cobalt Nanoparticles Addition on Shear Strength, Wettability and Interfacial Intermetallic Growth of Sn-3.0Ag-0.5Cu Solder during Thermal Cycling

Y. Gu, Y. Liu, X.C. Zhao, S.L. Wen, H. Li

Trans Tech Publications
11 国際会議録 Microstructure and Properties of A-Site Doping Bi4-xYxTi3O12 Ferrroelectric Thin Films

H.C. Liu, W.J. Zhang, X.C. Zhang, Q. Yu, J. Wang

Trans Tech Publications
6 国際会議録 TEM Observation of Interfacial Reaction Layers Formed Between Pb(Lead)-Free Sn-3.5Ag Solder and ENIG Plated Cu Substrate

Yoon, J.W., Jung, S.B.

Trans Tech Publications
12 国際会議録 Effects of Titanium Refining Methods on the Microstructure and Mechanical Properties of A356-0.1%Ti Alloys

J.W. Li, J.P. Xie, Z.X. Liu, W.Y. Wang

Trans Tech Publications
1
 
2
 
3
 
4
 
5
 
6
 
7
 
8
 
9
 
10
 
11
 
12