Interfacial Microstructures and Kinetics of Sn2.5Ag0.7Cu/Cu

Interfacial Microstructures and Kinetics of Sn2.5Ag0.7Cu/Cu

著者名:

掲載資料名:

Functional and electronic materials : selected, peer reviewed papers from IUMRS-ICA 2010, 11th IUMRS International Conference in Asia, 25-28 September 2010, Qingdao, China

シリーズ名:

Materials science forum

シリーズ巻号:

687

発行年:

2011

開始ページ:

112

終了ページ:

116

総ページ数:

5

出版情報:

Aedermannsdorf, Switzerland: Trans Tech Publications

ISSN:

02555476

言語:

英語

請求記号:

M23650

資料種別:

国際会議録

詳細

TDL書誌ID:	ZA00054184
シリーズID:	PA00000012
会議名:	IUMRS International Conference in Asia (IUMRS-ICA 2010)
回次:	11th
会議開催地:	Qingdao, China
会議開催年:	2010.09.25-2010.09.28
論文注記:	11th IUMRS International Conference in Asia (IUMRS-ICA 2010), 25-28 September 2010, Qingdao, China

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