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Thickness Effect on Microstructure and Residual Stress of Annealed Copper Thin Films

著者名:
掲載資料名:
Residual stresses VIII : selected, peer reviewed papers from the 8th European Conference on Residual Stresses, ECRS8, 2010, June 26-28, 2010, Riva del Garda, Italy
シリーズ名:
Materials science forum
シリーズ巻号:
681
発行年:
2011
開始ページ:
139
終了ページ:
144
総ページ数:
6
出版情報:
Aedermannsdorf, Switzerland: Trans Tech Publications
ISSN:
02555476
言語:
英語
請求記号:
M23650
資料種別:
国際会議録

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