Electroless Copper Plating on Ti3SiC2 Powder Surface Using Ascorbic Acid as a Reducing Agent

Electroless Copper Plating on Ti₃SiC₂ Powder Surface Using Ascorbic Acid as a Reducing Agent

著者名:

掲載資料名:

Eco-materials processing and design XI : ISEPD-11 : selected, peer reviewed papers from the 11th International Symposium on Eco-Materials Processing and Design, Osaka, Japan, January 9-12, 2010

シリーズ名:

Materials science forum

シリーズ巻号:

658

発行年:

2010

開始ページ:

471

終了ページ:

474

総ページ数:

4

出版情報:

Aedermannsdorf, Switzerland: Trans Tech Publications

ISSN:

02555476

言語:

英語

請求記号:

M23650

資料種別:

国際会議録

詳細

TDL書誌ID:	ZA00054163
シリーズID:	PA00000012
会議名:	International Symposium on Eco-Materials Processing and Design
回次:	11th
会議開催地:	Osaka, Japan
会議開催年:	2010.01.09-2010.01.12
論文注記:	11th International Symposium on Eco-Materials Processing and Design, Osaka, Japan, January 9-12, 2010

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