Effects of the Cooling Rate on the Solidification Microstructure of Cu-Ni Alloy
- 著者名:
- 掲載資料名:
- Eco-materials processing and design XI : ISEPD-11 : selected, peer reviewed papers from the 11th International Symposium on Eco-Materials Processing and Design, Osaka, Japan, January 9-12, 2010
- シリーズ名:
- Materials science forum
- シリーズ巻号:
- 658
- 発行年:
- 2010
- 開始ページ:
- 444
- 終了ページ:
- 447
- 総ページ数:
- 4
- 出版情報:
- Aedermannsdorf, Switzerland: Trans Tech Publications
- ISSN:
- 02555476
- 言語:
- 英語
- 請求記号:
- M23650
- 資料種別:
- 国際会議録
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