Sn-2.5Ag-0.7Cu-0.1Re-xNi Lead-Free Solder Alloy and its Creep Properties of Solder Joints

Sn-2.5Ag-0.7Cu-0.1Re-xNi Lead-Free Solder Alloy and its Creep Properties of Solder Joints

著者名:

掲載資料名:

Energy and environment materials : selected, peer reviewed papers from the 2009 C-MRS annual meeting on Energy and Environmental Materials, held in Suzhou, China, Oct. 15-17, 2009

シリーズ名:

Materials science forum

シリーズ巻号:

650

発行年:

2010

開始ページ:

91

終了ページ:

96

総ページ数:

6

出版情報:

Aedermannsdorf, Switzerland: Trans Tech Publications

ISSN:

02555476

言語:

英語

請求記号:

M23650

資料種別:

国際会議録

詳細

TDL書誌ID:	ZA00054157
シリーズID:	PA00000012
会議名:	C-MRS annual meeting on Energy and Environmental Materials
回次:	2009
会議開催地:	Suzhou, China
会議開催年:	2009.10.15-2009.10.17
論文注記:	2009 C-MRS Annual Meeting on Energy and Environmental Materials, Suzhou, China, Oct. 15-17, 2009

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