Thermal Resistance Control of an Optical Module Packaging by a Heat Sink of High Thermal Conductivity
- 著者名:
- 掲載資料名:
- Advanced welding and micro joining/packaging for the 21st century : selected peer reviewed papers from the International Welding/Joining Conference, Korea 2007 (IWJC, Korea 2007), which was held from 10th-12th May 2007 at COEX, Seoul, Korea
- シリーズ名:
- Materials science forum
- シリーズ巻号:
- 580-582
- 発行年:
- 2008
- 開始ページ:
- 163
- 終了ページ:
- 166
- 総ページ数:
- 4
- 出版情報:
- Aedermannsdorf, Switzerland: Trans Tech Publications
- ISSN:
- 02555476
- 言語:
- 英語
- 請求記号:
- M23650
- 資料種別:
- 国際会議録
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