Vacancy Engineering - An Ultra-Low Thermal Budget Method for High-Concentration ‘Diffusionless’' Implantation Doping

Vacancy Engineering - An Ultra-Low Thermal Budget Method for High-Concentration ‘Diffusionless’' Implantation Doping

著者名:

掲載資料名:

Rapid thermal processing and beyond : applications in semiconductor processing : special topic volume : selected papers from RTP specialists all over the world, Dornstadt, Germany

シリーズ名:

Materials science forum

シリーズ巻号:

573-574

発行年:

2008

開始ページ:

295

終了ページ:

304

総ページ数:

10

出版情報:

Aedermannsdorf, Switzerland: Trans Tech Publications

ISSN:

02555476

言語:

英語

請求記号:

M23650

資料種別:

国際会議録

詳細

TDL書誌ID:	ZA00054119
シリーズID:	PA00000012

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