Alignment and overlay metrology issues for copper/low-K dual-damascene interconnect

Alignment and overlay metrology issues for copper/low-K dual-damascene interconnect

著者名:

掲載資料名:

Metrology, inspection, and process control for microlithography XIII : 15-18 March, 1999, Santa Clara, California

シリーズ名:

Proceedings of SPIE - the International Society for Optical Engineering

シリーズ巻号:

3677

発行年:

1999

巻:

1

開始ページ:

107

終了ページ:

115

総ページ数:

9

出版情報:

Bellingham, Wash.: SPIE - The International Society of Optical Engineering

ISSN:

0277786X

ISBN:

9780819431516 [0819431516]

言語:

英語

請求記号:

P63600/3677

資料種別:

国際会議録

詳細

TDL書誌ID:	ZA00052894
シリーズID:	PA00000029
会議名:	Metrology, inspection, and process control for microlithography
回次:	13th
会議開催地:	Santa Clara, California, USA
会議開催年:	1999.03.15-1999.03.18
論文注記:	Metrology, Inspection, and Process Control for Microlithography XIII, Santa Clara, California, USA, March 15-18, 1999

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