STI Post CMP Cleaning Solution Development

STI Post CMP Cleaning Solution Development

著者名:

掲載資料名:

Chemical Mechanical Polishing 9

シリーズ名:

ECS transactions

シリーズ巻号:

13(4)

発行年:

2008

開始ページ:

75

終了ページ:

79

総ページ数:

5

出版情報:

Pennington, N.J.: Electrochemical Society

ISSN:

19385862

ISBN:

9781605601816 [1605601810]

言語:

英語

請求記号:

E23400/13-4 [4]

資料種別:

国際会議録

詳細

TDL書誌ID:	ZA00001694
シリーズID:	PA00000034
会議名:	ECS Meeting
回次:	213th
会議開催地:	Phoenix, AZ, USA
会議開催年:	2008.05.18-2008.05.23
論文注記:	213th ECS Meeting, May 18 - May 23, 2008, Phoenix, AZ

類似資料:

1 国際会議録 Post-CMP Challenges for Cu-Low K Integration Tamboli, D., Banerjee, G., Waddell, M., Listebarger, J., Arefeen, Q., Hymes, S. Electrochemical Society	7 国際会議録 AQUEOUS CRYOGENICALLY ENHANCED POST-COPPER CMP CLEANING Banerjee, S., Via, A., Joshi, S., Eklund, J. Electrochemical Society
2 国際会議録 CORROSION PROTECTION OF COPPER IN POST-CMP PROCESSING TAMBOLI, DNYANESH, BANERJEE, GAUTAM, RAO, MADHUKAR, LANGAN, JOHN Electrochemical Society	8 国際会議録 Mechanisms of Post-CMP Cleaning Liang, H., Estragnat, E., Lee, J., Bahten, K., McMullen, D. Materials Research Society
3 国際会議録 Non-contact Post-CMP Cleaning Using a Single Wafer Processing System Olesen, M.B., Fraser, B., Franklin, C., Bran, M. Electrochemical Society	9 国際会議録 POST W CMP CLEANING Constant, I., Marthon, S., Lardin, T., David, C., Jacquemond, M.N., Tardif, F. Electrochemical Society
4 国際会議録 EVALUATION OF NON-CONTACT POST-CMP CLEANING PROCESS UTILIZING SPLIT-LOT POLISHING AND CLEANING COMPARISONS Fraser, B., Olesen, M.B., Phan, T., Morrison, B. Electrochemical Society	10 国際会議録 Post-CMP Megasonic Cleaning Using Dilute SCI Solution Busnaina, A. A., Guarrera, M., Moumen, N., Piboontum, J. Materials Research Society
5 国際会議録 Effect of Additives in Post Cu CMP Cleaning Solutions on Particle Adhesion and Removal Hong, Y.K., Eom, D.H., Lee, S.H., Park, J.G., Busnaina, A.A. Electrochemical Society	11 国際会議録 Hydrophobic Interactions in Post-CMP Cleaning Stephen P. Beaudoin, Sean K. Eichenlaub American Institute of Chemical Engineers
6 国際会議録 Post Copper CMP Cleaning: A Non-Contact Megasonic Method Eissa, M., Joshi, S., Shinn, G., Rafie, S., Fraser, B. Electrochemical Society	12 国際会議録 Optimization of CMP Processes for STI Devices Using Novel Metrology Tools Hansen, D.A., Wu, C., Lu, H.B., Oyumi, M., Velidandla, V. Electrochemical Society

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