Electrochemical Mechanical Planarization (eCMP) of Copper Thin Films

Electrochemical Mechanical Planarization (eCMP) of Copper Thin Films

著者名:

掲載資料名:

Electrochemical Processing in ULSI and MEMS 2

シリーズ名:

ECS transactions

シリーズ巻号:

2(6)

発行年:

2007

開始ページ:

417

終了ページ:

425

総ページ数:

9

出版情報:

Pennington, N.J.: Electrochemical Society

ISSN:

19385862

ISBN:

9781566775175 [1566775175]

言語:

英語

請求記号:

E23400/2-6

資料種別:

国際会議録

詳細

TDL書誌ID:	ZA00046579
シリーズID:	PA00000034
会議名:	ECS Meeting
回次:	209th
会議開催地:	Denver, Colorado, USA
会議開催年:	2006.05.07-2006.05.12
論文注記:	209th ECS Meeting, May 7-May 12, 2006, Denver, Colorado

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1 国際会議録 Study on the Mechanism of Electrochemical Mechanical Deposition of Copper Layers Basol, B.M., Uzoh, C.E., Wang, T. Electrochemical Society	7 国際会議録 Development of Electrochemical Mechanical Polishing for Advanced Copper Planarization R. Jia, Y. Wang, Z. Wang, S. Tsai, J. Dma, D. Mao, L. Karuppiah, L. Chen Electrochemical Society
2 国際会議録 Potential-pH Diagrams of Interest to Chemical Mechanical Planarization of Copper Thin Films Aksu, Serdar Materials Research Society	8 国際会議録 Planar Copper Electrodeposition And Electropolishing Techniques Bülent Basol, Cyprian Uzoh, Homayoun Talieh, Tony Wang, George Guo American Institute of Chemical Engineers
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