Cu Filling Characteristics in Through-Si Via Holes by Electroless Plating with Addition of Inhibitors

Cu Filling Characteristics in Through-Si Via Holes by Electroless Plating with Addition of Inhibitors

著者名:

掲載資料名:

Electronics Packaging 3

シリーズ名:

ECS transactions

シリーズ巻号:

16(22)

発行年:

2009

開始ページ:

27

終了ページ:

32

総ページ数:

6

出版情報:

Pennington, NJ: Electrochemical Society

ISSN:

19385862

ISBN:

9781615672967 [1615672966]

言語:

英語

請求記号:

E23400/16-17 [22]

資料種別:

国際会議録

詳細

TDL書誌ID:	ZA00047186
シリーズID:	PA00000034
会議名:	Meeting of the Electrochemical Society
回次:	214th
会議開催地:	Honoulu, Hawaii, USA
会議開催年:	2008.10.12-2008.10.17
論文注記:	214th ECS Meeting, October 12-17, 2008, Honolulu, Hawaii, USA

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