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The Effect of a Threshold Failure Time on Electromigration Behavior of Copper Interconnects

著者名:
掲載資料名:
Copper Interconnects, New Contact Metallurgies/Structures, and Low-k Inter-level Dielectrics, at 214th ECS Meeting, October 12-17, 2008, Honolulu, Hawaii, USA
シリーズ名:
ECS transactions
シリーズ巻号:
16(19)
発行年:
2009
開始ページ:
31
終了ページ:
39
総ページ数:
9
出版情報:
Pennington, NJ: Electrochemical Society
ISSN:
19385862
ISBN:
9781615672936 [1615672931]
言語:
英語
請求記号:
E23400/16-17 [19]
資料種別:
国際会議録

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