“Seedless” Copper Electrochemical Deposition on Air Exposed TaN Barrier Layers with Pd and Ru Adhesion Promoters

“Seedless” Copper Electrochemical Deposition on Air Exposed TaN Barrier Layers with Pd and Ru Adhesion Promoters

著者名:

掲載資料名:

Atomic layer deposition applications 2

シリーズ名:

ECS transactions

シリーズ巻号:

3(15)

発行年:

2007

開始ページ:

153

終了ページ:

160

総ページ数:

8

出版情報:

Pennington, NJ: Electrochemical Society

ISSN:

19385862

ISBN:

9781566775427 [1566775426]

言語:

英語

請求記号:

E23400/3-15

資料種別:

国際会議録

詳細

TDL書誌ID:	ZA00047119
シリーズID:	PA00000034
会議名:	Symposium on Atomic Layer Deposition Applications ; Meeting of the Electrochemical Society
回次:	2nd ; 210th
会議開催地:	Cancun, Mexico
会議開催年:	2006.10.29-2006.11.01
論文注記:	2nd Symposium on Atomic Layer Deposition Applications, 210th meeting of the Electrochemical Society, Moon Palace Resort, Cancun, Mexico, October 29 - November 1, 2006

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1 国際会議録 'Seedless' Copper ECD on TiN Barrier Layers Kim, S., Duquette, D.J. Electrochemical Society	7 国際会議録 The Nucleation and Growth of Electrochemically Deposited Copper on PVD Copper and TiN using Alkaline (EDTA and NH 3) Baths Graham, L., Steinbruchel, C., Duquette , D.J., Chen, L. Electrochemical Society
2 国際会議録 The Evolution of Surface Roughness of Copper Electrodeposition Directly on Ultra-Thin Air Exposed TaN Layers N. Lay, D. Duquette Electrochemical Society	8 国際会議録 Pulsed Electrodeposition of Copper from Alkaline and Acid Baths for Metallization in Integrated Circuits Lee, C.Y., Duquette, D.J. Electrochemical Society
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