Blank Cover Image

The Consolidation of the End-to-End Avionics Systems Testbench

著者名:
掲載資料名:
Proceedings of DASIA 2014 : DAta Systems In Aerospace : 3-5 June 2014, Warsaw, Poland
シリーズ名:
ESA SP
シリーズ巻号:
725
発行年:
2014
総ページ数:
9
出版情報:
Noordwijk, The Netherlands: ESA Communications
ISSN:
1609042X
ISBN:
9789292212896 [9292212893]
言語:
英語
請求記号:
E11690/725
資料種別:
国際会議録

類似資料:

1 国際会議録 The SVF-Lite Configuration in the End to End System Test Bench Concept

Q. Wijnands, C. Leorato, R. Blommestijn

ESA Communications
7 国際会議録 Avionic System for the CIRA USV Program

G. Capuano, P. Longobardi, F. Cacace

ESA Communication Production Office
2 国際会議録 The ConeXpress System Facility (CSF) - Application of a Full Life-Cycle Concept

R. Blommestijn, P. Beerthuizen

ESA Publications Division
8 国際会議録 The pyramid wavefront sensor for the high order testbench (HOT)

E. Pinna, A. T. Puglisi, F. Quiros-Pacheco, L. Busoni, A. Tozzi

Society of Photo-optical Instrumentation Engineers
3 国際会議録 OMNIA: The New Generation System on Chip for Data Handling Onboard Computer

F. Torelli, G. Giachella, G. Aranci

ESA Publications Division
9 国際会議録 Optimisation of Pilot Capability and Avionic System Design

Stringer, F. S

Advisory Group for Aerospace Research and Development
4 テクニカルペーパー Real-Time Implementation of a Model Reference Adaptive Control System

Mooij, E., Wijnands, Q.

American Institute of Aeronautics and Astronautics
10 国際会議録 Bulk Ultrafine-Grained Nickel Consolidated from Nanopowders

J. Gubicza, Q.H. Bui, F. Fellah, N. Szász, G. Dirras

Trans Tech Publications
5 国際会議録 Integration of Heterogeneous Formal Techniques for the Design of Avionics Systems

Y. Aït-Ameur, E. Grolleau, N. Torrecillas, F. Boniol, R. Delmas

ESA Publications Division
11 国際会議録 Front End Bending in Plate Rolling Influenced by Asymmetrical Entrance Angle

Y.H. Pang, Y.L. Hu, Q. Sun, C.R. Liu, H.F. Yu

Trans Tech Publications
6 国際会議録 Proximity-1: Simulating the CCSDS Proximity-1 Protocol for ExoMars

R. Blommestijn, J. Lange, C. Taylor, A. Winton

ESA Communication Production Office
12 国際会議録 High-density, end-to-end optoelectronic integration and packaging for digital-optical interconnect systems (Invited Paper)

Chang, G. -K., Guidotti, D., Huang, Z. R., Wan, L., Yu, J., Hegde, S., Kuo, H. -F., Chang, Y, -J., Liu, F., Wang, F., …

SPIE - The International Society of Optical Engineering
1
 
2
 
3
 
4
 
5
 
6
 
7
 
8
 
9
 
10
 
11
 
12