Full-chip pitch/pattern splitting for lithography and spacer double patterning technologies

Full-chip pitch/pattern splitting for lithography and spacer double patterning technologies

著者名:

T.-B. Chiou ( ASML Taiwan Ltd., Taiwan )
R. Socha ( ASML, United States )
H.-Y. Kang ( ASML Korea Co., Ltd., Republic of Korea )
A. C. Chen ( ASML Taiwan Ltd., Taiwan )
S. Hsu ( ASML Brion, United States )

掲載資料名:

Lithography Asia 2008

シリーズ名:

Proceedings of SPIE - the International Society for Optical Engineering

シリーズ巻号:

7140

発行年:

2008

巻:

1

開始ページ:

71401Z-1

終了ページ:

71401Z-12

総ページ数:

12

出版情報:

Bellingham, Wash.: Society of Photo-optical Instrumentation Engineers

ISSN:

0277786X

ISBN:

9780819473813 [0819473812]

言語:

英語

請求記号:

P63600/7140

資料種別:

国際会議録

詳細

TDL書誌ID:	ZA00052771
シリーズID:	PA00000029
会議名:	Lithography Asia
回次:	2008
会議開催地:	Taipei, Taiwan
会議開催年:	2008.11.04-2008.11.06
論文注記:	Lithography Asia 2008, 4-6 November 2008, Taipei, Taiwan - Optical (DPT), 71401Z, 7140-70

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2 国際会議録 65-nm full-chip implementation using double dipole lithography Hsu, S.D., Chen, J.F., Cororan, N., Knose, W.T., Broeke, D.J.V.D., Laidig, T.L., Wampler, K.E., Shi, X., Hsu, C.M., … SPIE-The International Society for Optical Engineering	8 国際会議録 Application challenges with double patterning technology (DPT) beyond 45 nm [6349-75] Park, J., Hsu, S., Van Den Broeke, D., Chen, J. F., Dusa, M., Socha, R., Finders, J., Vleeming, B., van Oosten, A., … SPIE - The International Society of Optical Engineering
3 国際会議録 Near-0.3 k1 full pitch range contact hole patterning using chromeless phase lithography (CPL) Van Den Broeke, D.J., Socha, R., Hsu, S.D., Chen, J.F., Laidig, T.L., Corcoran, N., Hollerbach, U., Wampler, K.E., Shi, … SPIE - The International Society of Optical Engineering	9 国際会議録 Experimental verification of a model-based decomposition method for double dipole lithography Eurlings, M., Hsu, S.D., Hendrickx, E., op 't Root, W., Laidig, T.L., Chiou, T.-B., Chen, A., Chen, F., Vandenberghe, … SPIE - The International Society of Optical Engineering
4 国際会議録 Double dipole lithography for 65-nm node and beyond: a technology readiness review Hsu, S.D., Eurlings, M., Hendrickx, E., Van Den Broeke, D.J., Chiou, T.-B., Chen, J.F., Laidig, T.L., Shi, X., Finders, … SPIE - The International Society of Optical Engineering	10 国際会議録 Printing 95-nm DRAM full chip patterns in KrF lithography Kim, S.-K., Kim, J.-S., Yoo, T.-J., Kong, K.-K., Yun, H.-S., Kim, Y.-D., Kim, H.-R., Kim, Y.-S., Kim, H.S. SPIE-The International Society for Optical Engineering
5 国際会議録 Development of automatic OPC treatment and layout decomposition for double dipole lithography for low-k1 imaging Chiou, T.-B., Chen, A. C., Hsu, S. D., Eurlings, M., Hendrickx, E. SPIE - The International Society of Optical Engineering	11 国際会議録 Complex 2D pattern lithography at λ/4 resolution using chromeless phase lithography (CPL) Van Den Broeke, D.J., Chen, J.F., Laidig, T.L., Hsu, S.D., Wampler, K.E., Socha, R.J., Petersen, J.S. SPIE-The International Society for Optical Engineering
6 国際会議録 Dipole decomposition mask design for full-chip implementation at 100-nm technology node and beyond Hsu, S.D., Corcoran, N.P., Eurlings, M., Knose, W.T., Laidig, T.L., Wampler, K.E., Roy, S., Shi, X., Hsu, C.M., Chen, … SPIE-The International Society for Optical Engineering	12 国際会議録 Novel lithography rule check for full-chip side lobe detection T. S. Wu, E. Yang, T. H. Yang, K. C. Chen, C. Y. Lu Society of Photo-optical Instrumentation Engineers

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