Finite element modeling of PAG leaching and water uptake in immersion lithography resist materials

Finite element modeling of PAG leaching and water uptake in immersion lithography resist materials

著者名:

B. M. Rathsack ( Tokyo Electron America Inc., USA )
S. Scheer ( Tokyo Electron America Inc., USA )
Y. Kuwahara ( Tokyo Electron Kyushu Ltd., Japan )
J. Kitano ( Tokyo Electron Kyushu Ltd., Japan )
R. Gronheid ( IMEC, Belgium )

掲載資料名:

Advances in resist materials and processing technology XXV

シリーズ名:

Proceedings of SPIE - the International Society for Optical Engineering

シリーズ巻号:

6923

発行年:

2008

巻:

1

開始ページ:

692315-1

終了ページ:

692315-11

総ページ数:

11

出版情報:

Bellingham, Wash.: Society of Photo-optical Instrumentation Engineers

ISSN:

0277786X

ISBN:

9780819471086 [0819471089]

言語:

英語

請求記号:

P63600/6923

資料種別:

国際会議録

詳細

TDL書誌ID:	ZA00052554
シリーズID:	PA00000029
会議名:	SPIE Advanced Lithography : Advances in Resist Materials and Processing Technology
回次:	2008 : 25th
会議開催地:	San Jose, California, USA
会議開催年:	2008.02.25-2008.02.27
論文注記:	Advances in resist materials and processing technology XXV, 25-27 February 2008, San Jose, California, USA. Session 9. Resist Fundamentals, 692315, 6923-43

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