Low Profile Packaging for MEMS Aero-acoustic Sensors

Low Profile Packaging for MEMS Aero-acoustic Sensors

著者名:

掲載資料名:

MEMS, bioMEMS and bioelectronics : materials and devices : symposium held November 28-December 2 2011, Boston, Massachusetts, U.S.A.

シリーズ名:

Materials Research Society symposium proceedings

シリーズ巻号:

1415

発行年:

2012

開始ページ:

3

終了ページ:

10

総ページ数:

8

出版情報:

Warrendale, PA: Materials Research Society

ISSN:

02729172

ISBN:

9781605113920 [1605113921]

言語:

英語

請求記号:

M23500/1415

資料種別:

国際会議録

詳細

TDL書誌ID:	ZA00051887
シリーズID:	PA00000011
会議名:	2011 MRS Fall Meeting ; Symposium TT, Microelectromechanical Systems-Materials and Devices V
回次:	2011
会議開催地:	Boston, MA
会議開催年:	2011.11.28-2011.12.02

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