32nm Node Highly Reliable Cu/Low-k Integration Technology with CuMn Alloy Seed

32nm Node Highly Reliable Cu/Low-k Integration Technology with CuMn Alloy Seed

著者名:

Shaoning Yao

Oluwafemi O. Ogunsola

Stephan Grunow

さらに 6 件

掲載資料名:

Materials, processes, and reliability for advanced interconnects for micro- and nanoelectronics--2011 : symposium held April 25-29, 2011, San Francisco, California, U.S.A.

シリーズ名:

Materials Research Society symposium proceedings

シリーズ巻号:

1335

発行年:

2012

開始ページ:

81

終了ページ:

86

総ページ数:

6

出版情報:

Warrendale, PA: Materials Research Society

ISSN:

02729172

ISBN:

9781605113128 [1605113123]

言語:

英語

請求記号:

M23500/1335

資料種別:

国際会議録

詳細

TDL書誌ID:	ZA00051868
シリーズID:	PA00000011
会議名:	2011 MRS Spring Meeting ; Symposium O, Materials, Processes, and Reliability for Advanced Interconnects for Micro- and Nanoelectronics
回次:	2011
会議開催地:	San Francisco, CA
会議開催年:	2011.04.25-2011.04.29

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