Blank Cover Image

THE EFFECTS OF PROCESS-INDUCED DEFECTS ON THE CHEMICAL SELECTIVITY OF HIGHLY-DOPED BORON ETCHSTOPS

著者名:
掲載資料名:
Proceedings of the Second International Symposium on Semiconductor Wafer Bonding--Science, Technology, and Applications
シリーズ名:
Electrochemical Society Proceedings Series
シリーズ巻号:
1993-29
発行年:
1993
開始ページ:
423
終了ページ:
432
総ページ数:
10
出版情報:
Pennington, NJ: Electrochemical Society
ISSN:
01616374
ISBN:
9781566770682 [1566770688]
言語:
英語
請求記号:
E23400/940556
資料種別:
国際会議録

類似資料:

1 国際会議録 LOW TEMPERATURE WAFER BONDING OF SURFACES USING A REACTIVE SPUTTERED OXIDE

J.A. Folta, C.B. Hunt, S.N. Farrens

Electrochemical Society
7 国際会議録 LOW TEMPERATURE SILICON DIRECT BONDING

B.B. Roberds, S.N. Farrens

Electrochemical Society
2 国際会議録 ANALYSIS OF BOND CHARACTERISTICS IN SIDIRECT-BONDED MATERIALS

S.N. Farrens, B.E. Roberds, J.K. Smith, C.B. Hunt

Electrochemical Society
8 国際会議録 DEFECTS RELATED TO MIXING BEHAVIOR OF HIGHLY SILICON-DOPED GaAs/A1As SUPERLATTICES

Theodore, N. D., Carter, C. B., Mei, P., Schwarz, S.A., Harbison, J. P., Venkatesan, T.

Materials Research Society
3 国際会議録 MECHANICAL TESTING OF BONDED SILICON ON INSULATOR WAFERS

Farrens, S. N., Roberds, B., Boettcher, M. C., Ismail, M. S., Bowewr, R. W., Desmond, C. A., Hunt, C. E.

Materials Research Society
9 国際会議録 CHARACTERIZATION OF THIN-FILM BESOI USING A CVD Si1x-y-Gex-By ETCH STOP

Desmond, C.A., Hunt, C.E., Wetteroth, T.

Electrochemical Society
4 国際会議録 Packaging methods and techniques for MOEMS and MEMS (Invited Paper)

Farrens, S.N.

SPIE - The International Society of Optical Engineering
10 国際会議録 Atmospheric Plasma Conditions Compatible with Wafer to Wafer Bonding Strategies

S.N. Farrens, M. Gabriel

Electrochemical Society
5 国際会議録 P+ removal techniques for thin-film BESOI

Desmond, C.A., Hunt, C.E., Collins, S.D.

Electrochemical Society
11 国際会議録 CCD camera baseline calibration and its effects on imaging processing and laser beam analysis

Roundy,C.B.

SPIE-The International Society for Optical Engineering
6 国際会議録 Low-Temperature, In Situ, Plasma Activated Wafer Bonding

Roberds, B.E., Farrens, S.N.

Electrochemical Society
12 国際会議録 Thermally Induced Dislocation and Slip Defects in Silicon

Cho, C.R., Kim, Y.S., Lee, J.K., Ko, S.W., Choi, D.J., Son, C.B., Stephens, A.E., Rozgonyi, G.A.

Electrochemical Society
1
 
2
 
3
 
4
 
5
 
6
 
7
 
8
 
9
 
10
 
11
 
12