SILICON LAYER TRANSFER BY WAFER BONDING

SILICON LAYER TRANSFER BY WAFER BONDING

著者名:

掲載資料名:

Proceedings of the Second International Symposium on Semiconductor Wafer Bonding--Science, Technology, and Applications

シリーズ名:

Electrochemical Society Proceedings Series

シリーズ巻号:

1993-29

発行年:

1993

開始ページ:

395

終了ページ:

409

総ページ数:

15

出版情報:

Pennington, NJ: Electrochemical Society

ISSN:

01616374

ISBN:

9781566770682 [1566770688]

言語:

英語

請求記号:

E23400/940556

資料種別:

国際会議録

詳細

TDL書誌ID:	ZA00051847
シリーズID:	PA00000028
会議名:	Second International Symposium on Semiconductor Wafer Bonding: Science, Technology, and Applications ; Hawaii Meeting of the Elactrochemical Society
回次:	2nd ; 1993
会議開催地:	HI
会議開催年:	1993.05.16-1993.05.21

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1 国際会議録 Thick Wafer Bonding Tong, Q-Y, Gosele, U. Electrochemical Society	7 国際会議録 Layer Transfer onto a Dissimilar Material Substrate by Wafer Bonding and Layer Splitting Lee, T.H., Tong, Q.-Y., Zhang, H.-Z., Ding, X.-F., Sin, J.K.O. Electrochemical Society
2 国際会議録 LOW TEMPERTURE WAFER DIRECT BONDING Q.-Y. Tong, G. Cha, R. Gafiteanu, U. Gosele Electrochemical Society	8 国際会議録 Wafer Bonding and Layer Transfer for Microsystems: An Overview Tong, Qin-Yi Electrochemical Society
3 国際会議録 DESIGN CONSIDERATIONS FOR WAFER BONDING OF DISSIMILAR MATERIALS G. Cha, R. Gafiteanu, Q.-Y. Tong, U. Gosele Electrochemical Society	9 国際会議録 Direct Wafer Bonding and Layer Transfer: An Innovative Way for the Integration of Ferroelectric Oxides Into Silicon Technology Alexe, M., Senz, St., Pignolet, A., Scott, J. F., Hesse, D., Gosele, U. MRS - Materials Research Society
4 国際会議録 Interface Defects of Bonded Silicon Wafers Reiche,M., Tong,Q.-Y., Gosele,U., Heydenreich,J. Trans Tech Publications	10 国際会議録 DISSOLUTION AND DISINTEGRATION OF UNIFORM SiO2 LAYERS DURING DIRECT SILICON WAFER BONDING Ahn, K. -Y., Gosele, U., Smith, P. Materials Research Society
5 国際会議録 Wafer bonding involving complex oxides Alexe, M., Kopperschmidt, P., Gosele, U., Tong, Q-Y., Huang, L-J. MRS-Materials Research Society	11 国際会議録 Progress in silicon-to-silicon direct bonding and its application to synchrotron x-ray optics Graber,T., Krasnicki,S.F., Fernandez,P.B., Mills,D.M., Tong,Q.-Y., Gosele,U.M. SPIE-The International Society for Optical Engineering
6 国際会議録 Wafer Bonding and Layer Transfer Approach for Strained Silicon-on-Insulator(SSOI) Fabrication Singh, R., Radu, I., Reiche, M., Gosele, U., Christiansen, S.H., Webb, D. Electrochemical Society	12 国際会議録 Process Design of Low Temperature Wafer Bonding Tong, Q-Y., Goesele, U. Electrochemical Society

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