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Deep Submicron Contact Hole Filling by Aluminum CVD at Low Temperature

著者名:
K. Sugai
H. Okabayashi
T. Shinzawa
S. Kishida
T. Okabayashi
N. Hosokawa
T. Yako
H. Kadokura
M. Isemura
M. Naruse
さらに 5 件
掲載資料名:
Proceedings of the Symposia on Interconnects, Contact Metallization, and Multilevel Metallization and Reliability for Semiconductor Devices, Interconnects, amd Thin Insulator Materials
シリーズ名:
Electrochemical Society Proceedings Series
シリーズ巻号:
1993-25
発行年:
1993
開始ページ:
290
終了ページ:
298
総ページ数:
9
出版情報:
Pennington, NJ: Electrochemical Society
ISSN:
01616374
ISBN:
9781566770675 [156677067X]
言語:
英語
請求記号:
E23400/940140
資料種別:
国際会議録

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