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The Effects of Hardness Variation on Chemical Mechanical Polishing of Copper Thin Films

著者名:
掲載資料名:
Science and technology of chemical mechanical planarization (CMP) : symposium held April 14-16, 2009, San Francisco, California, U.S.A.
シリーズ名:
Materials Research Society symposium proceedings
シリーズ巻号:
1157
発行年:
2010
開始ページ:
99
終了ページ:
108
総ページ数:
10
出版情報:
Warrendale, Pa.: Materials Research Society
ISSN:
02729172
ISBN:
9781605111308 [1605111309]
言語:
英語
請求記号:
M23500/1157
資料種別:
国際会議録

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