Fundamental Mechanisms of Copper CMP – Passivation Kinetics of Copper in CMP Slurry Constituents

Fundamental Mechanisms of Copper CMP – Passivation Kinetics of Copper in CMP Slurry Constituents

著者名:

掲載資料名:

Science and technology of chemical mechanical planarization (CMP) : symposium held April 14-16, 2009, San Francisco, California, U.S.A.

シリーズ名:

Materials Research Society symposium proceedings

シリーズ巻号:

1157

発行年:

2010

開始ページ:

79

終了ページ:

84

総ページ数:

6

出版情報:

Warrendale, Pa.: Materials Research Society

ISSN:

02729172

ISBN:

9781605111308 [1605111309]

言語:

英語

請求記号:

M23500/1157

資料種別:

国際会議録

詳細

TDL書誌ID:	ZA00049469
シリーズID:	PA00000011
会議名:	MRS Spring Meeting
回次:	2009
会議開催地:	San Francisco, California, USA
会議開催年:	2009.04.14-2009.04.16

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