Optimizing Pad Groove Design and Polishing Kinematics for Reduced Shear Force, Low Force Fluctuation and Optimum Removal Rate Attributes of Copper CMP

Optimizing Pad Groove Design and Polishing Kinematics for Reduced Shear Force, Low Force Fluctuation and Optimum Removal Rate Attributes of Copper CMP

著者名:

Yasa Sampurno

掲載資料名:

Science and technology of chemical mechanical planarization (CMP) : symposium held April 14-16, 2009, San Francisco, California, U.S.A.

シリーズ名:

Materials Research Society symposium proceedings

シリーズ巻号:

1157

発行年:

2010

開始ページ:

3

終了ページ:

8

総ページ数:

6

出版情報:

Warrendale, Pa.: Materials Research Society

ISSN:

02729172

ISBN:

9781605111308 [1605111309]

言語:

英語

請求記号:

M23500/1157

資料種別:

国際会議録

詳細

TDL書誌ID:	ZA00049469
シリーズID:	PA00000011
会議名:	MRS Spring Meeting
回次:	2009
会議開催地:	San Francisco, California, USA
会議開催年:	2009.04.14-2009.04.16

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