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Pretreatment and Deposition of Copper on Polyimide for Flexible Copper Clad Laminate Using Vacuum Web Sputtering System

著者名:
  • J. Cho ( Toray Saehan, Inc., Seoul, Korea )
  • B.J. Kim ( Toray Saehan, Inc., Seoul, Korea )
  • Y.S. Kim ( Toray Saehan, Inc., Seoul, Korea )
  • H.W. Choi ( Thin Film Materials Research Center (TF-MRC), Korea Institute of Science and Technology, Seoul, Korea )
  • W.K. Choi ( Thin Film Materials Research Center (TF-MRC), Korea Institute of Science and Technology, Seoul, Korea )
掲載資料名:
49th annual technical conference proceedings, April 22-27, 2006, Washington, D.C.
シリーズ名:
Annual Technical Conference of Society of Vacuum Coaters
シリーズ巻号:
49
発行年:
2006
開始ページ:
669
終了ページ:
672
総ページ数:
4
出版情報:
Albuquerque, NM: Society of Vacuum Coaters
ISSN:
07375921
言語:
英語
請求記号:
A63930/49
資料種別:
国際会議録

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