Chemical Mechanical Polishing of SiCOH-Based Low-k Dielectrics
- 著者名:
W. Tseng A. Sakamoto S. Ponoth D. Hong L. Economikos S. Vogt A. Ticknor S. Cohen M. Krishnan R. Wanner B. Kim - 掲載資料名:
- Dielectrics for nanosystems II: materials science, processing, reliability, and manufacturing
- シリーズ名:
- ECS transactions
- シリーズ巻号:
- 2(1)
- 発行年:
- 2006
- 開始ページ:
- 227
- 終了ページ:
- 236
- 総ページ数:
- 10
- 出版情報:
- Pennington, N.J.: Electrochemical Society
- ISSN:
- 19385862
- ISBN:
- 9781566774383 [1566774381]
- 言語:
- 英語
- 請求記号:
- E23400/2-1
- 資料種別:
- 国際会議録
類似資料:
Materials Research Society |
7
国際会議録
Characterization of the Chemical Effects of Ceria Slurries for Chemical Mechanical Polishing
Materials Research Society |
Electrochemical Society |
MRS - Materials Research Society |
3
国際会議録
The Intercorrelation Between Microstructure and Chemical-Mechanical Polish of Metal Thin Films
MRS - Materials Research Society |
MRS - Materials Research Society |
Electrochemical Society |
American Chemical Society |
MRS - Materials Research Society |
11
国際会議録
Evaluation of pad life in chemical mechanical polishing process using statistical metrology
SPIE-The International Society for Optical Engineering |
6
国際会議録
Comparison of Mechanical and Chemomechanical Polished SiC Wafers Using Photon Backscattering
Trans Tech Publications |
Materials Research Society |