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Control of Edge Shape, Sidewall Profile, and Sidewall Roughness of the Plasma Etched Copper

著者名:
掲載資料名:
Copper interconnects, new contact and barrier metallurgies/structures, and low-k interlevel dielectrics III : at the 208th ECS meeting, October 16-21, 2005, Los Angeles, California, USA
シリーズ名:
ECS transactions
シリーズ巻号:
1(11)
発行年:
2006
開始ページ:
169
終了ページ:
176
総ページ数:
8
出版情報:
Pennington, NJ: Electrochemical Society
ISSN:
19385862
ISBN:
9781566774994 [1566774993]
言語:
英語
請求記号:
E23400/1-11
資料種別:
国際会議録

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