SUPRESSION OF SURFACE MICRO-ROUGHNESS OF SILICON WAFER BY ADDITION OF ALCOHOL INTO ULTRA PURE WATER FOR RINSING PROCESS

SUPRESSION OF SURFACE MICRO-ROUGHNESS OF SILICON WAFER BY ADDITION OF ALCOHOL INTO ULTRA PURE WATER FOR RINSING PROCESS

著者名:

掲載資料名:

Cleaning Technology in Semiconductor Device Manufacturing IX

シリーズ名:

ECS transactions

シリーズ巻号:

1(3)

発行年:

2006

開始ページ:

51

終了ページ:

58

総ページ数:

8

出版情報:

Pennington, NJ: Electrochemical Society

ISSN:

19385862

ISBN:

9781566774291 [1566774292]

言語:

英語

請求記号:

E23400/1-3

資料種別:

国際会議録

詳細

TDL書誌ID:	ZA00047097
シリーズID:	PA00000034
会議名:	International Symposium on Cleaning Technology in Semiconductor Device Manufacturing ; Fall Meeting of the Electrochemical Society
回次:	9th ; 2005
会議開催地:	Los Angeles, California, USA
会議開催年:	2005.10.00

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