Thermal Simulations of 3-D Integrated Multi-Chip Module With GaN Power Amplifier and Si Modulator
- 著者名:
- 掲載資料名:
- State-of-the-Art Program on Compound Semiconductors (SOTAPOCS XLIII) and Nitride and Wide Bandgap Semiconductors for Sensors, Photonics, and Electronics VI
- シリーズ名:
- ECS transactions
- シリーズ巻号:
- 1(2)
- 発行年:
- 2006
- 開始ページ:
- 94
- 終了ページ:
- 102
- 総ページ数:
- 9
- 出版情報:
- Pennington, N.J.: Electrochemical Society
- ISSN:
- 19385862
- ISBN:
- 9781566774314 [1566774314]
- 言語:
- 英語
- 請求記号:
- E23400/1-2
- 資料種別:
- 国際会議録
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6
国際会議録
Novel Oxides and Reliability for the Passivation of AlGaN/GaN High Electron Mobility Transistor
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Electrochemical Society |