Contact Model for a Pad Asperity and a Wafer Surface in the Presence of Abrasive Particles for Chemical Mechanical Polishing

Contact Model for a Pad Asperity and a Wafer Surface in the Presence of Abrasive Particles for Chemical Mechanical Polishing

著者名:

掲載資料名:

Advances and challenges in chemical mechanical planarization : symposium held April 10-12, 2007, San Francisco, California, U.S.A.

シリーズ名:

Materials Research Society symposium proceedings

シリーズ巻号:

991

発行年:

2007

開始ページ:

343

終了ページ:

348

総ページ数:

6

出版情報:

Warrendale, Pa.: Materials Research Society

ISSN:

02729172

ISBN:

9781558999510 [1558999515]

言語:

英語

請求記号:

M23500/991

資料種別:

国際会議録

詳細

TDL書誌ID:	ZA00048533
シリーズID:	PA00000011
会議名:	MRS Spring Meeting
回次:	2007
会議開催地:	San Francisco, California, USA
会議開催年:	2007.04.10-2007.04.12

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