Prediction of interconnect delay variations using pattern matching

Prediction of interconnect delay variations using pattern matching

著者名:

E. Y. Chin ( Univ. of California, Berkeley (USA) )
J. A. Holwill ( Univ. of California, Berkeley (USA) )
A. R. Neureuther ( Univ. of California, Berkeley (USA) )

掲載資料名:

Design for manufacturability through design-process integration : 28 February-2 March 2007, San Jose, California, USA

シリーズ名:

Proceedings of SPIE - the International Society for Optical Engineering

シリーズ巻号:

6521

発行年:

2007

出版情報:

Bellingham, Wash.: SPIE - The International Society of Optical Engineering

ISSN:

0277786X

ISBN:

9780819466402 [0819466409]

言語:

英語

請求記号:

P63600/6521

資料種別:

国際会議録

詳細

TDL書誌ID:	ZA00046828
シリーズID:	PA00000029
会議名:	SPIE Advanced Lithography : Design for Manufacturability through Design-Process Integration
回次:	2007
会議開催地:	San Jose, CA, USA
会議開催年:	2007.02.28-2007.03.02

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