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Adhesive wafer-to-wafer bonding using contact imprinting

著者名:
  • L. Yu ( Institute of Bioengineering and Nanotechnology (Singapore) and National Univ. of Singapore (Singapore) )
  • A. J. Pang ( Institute of Bioengineering and Nanotechnology (Singapore) )
  • B. Chen ( Institute of Bioengineering and Nanotechnology (Singapore) )
  • F. E. H. Tay ( Institute of Bioengineering and Nanotechnology (Singapore) and National Univ. of Singapore (Singapore) )
  • C. Iliescu ( Institute of Bioengineering and Nanotechnology (Singapore) )
掲載資料名:
Micro- and nanotechnology : materials, processes, packaging, and systems III : 11-13 December 2006, Adelaide, Australia
シリーズ名:
Proceedings of SPIE - the International Society for Optical Engineering
シリーズ巻号:
6415
発行年:
2007
ペーパー番号:
64151I
出版情報:
Bellingham, Wash.: SPIE - The International Society of Optical Engineering
ISSN:
0277786X
ISBN:
9780819465238 [0819465232]
言語:
英語
請求記号:
P63600/6415
資料種別:
国際会議録

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