The Effect of Copper Content on the Dynamic Grain Growth in AL-Cu-Zr Systems

The Effect of Copper Content on the Dynamic Grain Growth in AL-Cu-Zr Systems

著者名:

掲載資料名:

Recrystallization and grain growth III : proceedings of the Third International Conference on Recrystallization and Grain Growth, ReX & GG III, held in Jeju Island, Korea, June 10-15 2007

シリーズ名:

Materials science forum

シリーズ巻号:

558-559(1)

発行年:

2007

巻:

558-559

開始ページ:

803

終了ページ:

810

総ページ数:

8

出版情報:

Stafa-Zuerich: Trans Tech Publications

ISSN:

02555476

ISBN:

9780878494439 [087849443X]

言語:

英語

請求記号:

M23650

資料種別:

国際会議録

詳細

TDL書誌ID:	ZA00046611
シリーズID:	PA00000012
会議名:	Joint International Conference on Recrystallization and Grain Growth
回次:	3rd
会議開催地:	Jeju Island, Korea
会議開催年:	2007.06.10-2007.06.15

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