Reliability Evaluation of Underfill Encapsulated Pb-Free Flip Chip Package under Thermal Shock Test

Reliability Evaluation of Underfill Encapsulated Pb-Free Flip Chip Package under Thermal Shock Test

著者名:

D.G. Kim

掲載資料名:

Eco-materials processing and design VIII : ISEPD-8, proceedings of the 8th International Symposium on Eco-Materials Processing and Design, January 11-13, 2007, Kitakyushu, Japan

シリーズ名:

Materials science forum

シリーズ巻号:

544-545

発行年:

2007

開始ページ:

621

終了ページ:

624

総ページ数:

4

出版情報:

Stafa-Zuerich, Switzerland: Trans Tech Publications

ISSN:

02555476

ISBN:

9780878494316 [0878494316]

言語:

英語

請求記号:

M23650

資料種別:

国際会議録

詳細

TDL書誌ID:	ZA00046600
シリーズID:	PA00000012
会議名:	ISEPD - International Symposium on Eco-Materials Processing and Design
回次:	2007 : 8th
会議開催地:	Kitakyushu, Japan
会議開催年:	2007.01.11-2007.01.13

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