The Effect of Crucible Configuration on Joule and Pinch Effects in EMCC Process of Silicon

The Effect of Crucible Configuration on Joule and Pinch Effects in EMCC Process of Silicon

著者名:

掲載資料名:

THERMEC 2006 : supplement to THERMEC 2006, 5th International conference on processing and manufacturing of advanced materials, July 4-8, 2006, Vancouver, Canada

シリーズ名:

Materials science forum

シリーズ巻号:

539-543(4)

発行年:

2007

巻:

539-543

開始ページ:

3179

終了ページ:

3183

総ページ数:

5

出版情報:

Stafa-Zuerich: Trans Tech Publications

ISSN:

02555476

ISBN:

9780878494286 [0878494286]

言語:

英語

請求記号:

M23650

資料種別:

国際会議録

詳細

TDL書誌ID:	ZA00046598
シリーズID:	PA00000012
会議名:	THERMEC ; International conference on processing and manufacturing of advanced materialsMATERIALS
回次:	2006 ; 5th
会議開催地:	Vancouver, Canada
会議開催年:	2006.07.04-2006.07.08

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