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Waveguide and packaging technology for optical backplanes and hybrid electrical-optical circuit boards (Invited Paper) [6124-07]

著者名:
Schroder, H. ( Fraunhofer IZM (Germany) )
Bauer, J. ( Fraunhofer IZM (Germany) )
Ebling, F. ( Fraunhofer IZM (Germany) )
Franke, M. ( Siemens AG (Germany) )
Beier, A. ( Siemens AG (Germany) )
Demmer, P. ( Siemens AG (Germany) )
Sullau, W. ( Ilfa Feinstleitertechnik GmbH (Germany) )
Kostelnik, J. ( Wurth Elektronik GmbH & Co. KG (Germany) )
Modinger, R. ( Erni Elektroapparate GmbH (Germany) )
Pfeiffer, K. ( micro resist technology GmbH (Germany) )
Ostrzinski, U. ( micro resist technology GmbH (Germany) )
Griese, E. ( Univ. Siegen (Germany) )
さらに 7 件
掲載資料名:
Optoelectronic Integrated Circuits VIII
シリーズ名:
Proceedings of SPIE - the International Society for Optical Engineering
シリーズ巻号:
6124
発行年:
2006
開始ページ:
612407
出版情報:
Bellingham, Wash.: SPIE - The International Society of Optical Engineering
ISSN:
0277786X
ISBN:
9780819461667 [0819461660]
言語:
英語
請求記号:
P63600/6124
資料種別:
国際会議録

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