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Self-assembled porous silica/Cu damascene interconnects for 45nm node and beyond (invited Papre) [6002-23]

著者名:
Kikkawa T. ( Hiroshima Univ. (Japan) and National Institute of Advance Industrial Science and Technology (Japan) )
Yagi R.
Chikaki S.
Shimoyama M.
Ono T.
Fujii N.
Kohmura K.
Tanaka H.
Nakayama T.
Ishikawa A.
Motsuo H.
Sonoda Y.
Hata N.
Seino Y.
Yoshino T.
さらに 10 件
掲載資料名:
Nanofabrication: Technologies, Devices, and Applications II
シリーズ名:
Proceedings of SPIE - the International Society for Optical Engineering
シリーズ巻号:
6002
発行年:
2005
開始ページ:
60020M
出版情報:
Bellingham, Wash.: SPIE - The International Society of Optical Engineering
ISSN:
0277786X
ISBN:
9780819460264 [0819460265]
言語:
英語
請求記号:
P63600/6002
資料種別:
国際会議録

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