Study of effects of sidewall angle on process window using 193nm CPL masks in a 300mm wafer manufacturing environment [5992-92]

Study of effects of sidewall angle on process window using 193nm CPL masks in a 300mm wafer manufacturing environment [5992-92]

著者名:

Cheng, Y. F.
Chou, Y. L.
Lin, C. L.
Huang, P. ( United Microelectronics Corp. (Taiwan) )

掲載資料名:

25th Annual BACUS Symposium on Photomask Technology

シリーズ名:

Proceedings of SPIE - the International Society for Optical Engineering

シリーズ巻号:

5992

発行年:

2005

パート:

2

開始ページ:

59922R

出版情報:

Bellingham, Wash.: SPIE - The International Society of Optical Engineering

ISSN:

0277786X

ISBN:

9780819460141 [0819460141]

言語:

英語

請求記号:

P63600/5992

資料種別:

国際会議録

詳細

TDL書誌ID:	ZA00016029
シリーズID:	PA00000029
会議名:	SPIE Photomask Technology : Annual BACUS Symposium on Photomask Technology
回次:	2005 : 25th
会議開催地:	Monterey, California, USA
会議開催年:	2005.10.04-2005.10.07

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