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Thermal and Electromigration-Induced Strains in Copper Conductor Lines: X-Ray Microbeam Measurements and Analysis

著者名:
Wang, G.
Zhang, H.
Cargill III, G.S.
Hu, C.-K.
Ge, Y.
Maniatty, A.
さらに 1 件
掲載資料名:
Materials, technology and reliability of low-k dielectrics and copper interconnects : symposium held April 18-21, 2006, San Francisco, California, U.S.A.
シリーズ名:
Materials Research Society symposium proceedings
シリーズ巻号:
914
発行年:
2006
開始ページ:
325
終了ページ:
330
総ページ数:
6
出版情報:
Warrendale, Pa.: Materials Research Society
ISSN:
02729172
ISBN:
9781558998705 [1558998705]
言語:
英語
請求記号:
M23500/914
資料種別:
国際会議録

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