The Role of Arginine as a Complexing Agent in Copper CMP
- 著者名:
- 掲載資料名:
- Materials, technology and reliability of low-k dielectrics and copper interconnects : symposium held April 18-21, 2006, San Francisco, California, U.S.A.
- シリーズ名:
- Materials Research Society symposium proceedings
- シリーズ巻号:
- 914
- 発行年:
- 2006
- 開始ページ:
- 207
- 終了ページ:
- 212
- 総ページ数:
- 6
- 出版情報:
- Warrendale, Pa.: Materials Research Society
- ISSN:
- 02729172
- ISBN:
- 9781558998705 [1558998705]
- 言語:
- 英語
- 請求記号:
- M23500/914
- 資料種別:
- 国際会議録
類似資料:
|
American Institute of Chemical Engineers |
American Institute of Chemical Engineers |
|
American Institute of Chemical Engineers |
Materials Research Society |
|
Electrochemical Society |
American Institute of Chemical Engineers |
|
American Institute of Chemical Engineers |
American Institute of Chemical Engineers |
|
American Institute of Chemical Engineers |
American Institute of Chemical Engineers |
|
American Institute of Chemical Engineers |
American Institute of Chemical Engineers |
