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*AREA ARRAY SOLDER JOINTS FOR PASSIVE ALIGNMENT

著者名:
掲載資料名:
Electronic packaging materials science VI : symposium held April 27-30, 1992, San Francisco, California, U.S.A.
シリーズ名:
Materials Research Society symposium proceedings
シリーズ巻号:
264
発行年:
1992
開始ページ:
423
終了ページ:
434
総ページ数:
12
出版情報:
Pittsburgh, Pa.: Materials Research Society
ISSN:
02729172
ISBN:
9781558991699 [1558991697]
言語:
英語
請求記号:
M23500/264
資料種別:
国際会議録

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