QUICK TESTS FOR ELECTROMIGRATION: USEFUL BUT NOT WITHOUT DANGER

QUICK TESTS FOR ELECTROMIGRATION: USEFUL BUT NOT WITHOUT DANGER

著者名:: Lloyd, J. R.
掲載資料名:: Advanced metallization and processing for semiconductor devices and circuits--II : symposium held April 27-May 1, 1992, San Francisco, California, U.S.A.
シリーズ名:: Materials Research Society symposium proceedings
シリーズ巻号:: 260
発行年:: 1992
開始ページ:: 735
終了ページ:: 744
総ページ数:: 10
出版情報:: Pittsburgh, Pa.: Materials Research Society
ISSN:: 02729172
ISBN:: 9781558991552 [1558991557]
言語:: 英語
請求記号:: M23500/260
資料種別:: 国際会議録

詳細

TDL書誌ID:	ZA00015744
シリーズID:	PA00000011
会議名:	Symposium on advanced metallization and processing for semiconductor devices and circuits
回次:	2nd
会議開催地:	San Francisco, CA, USA
会議開催年:	1992.04.27-1992.05.01

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6 国際会議録 30 Years of Electromigration Research: A Grand Masters' Perspective Lloyd, J. R. MRS - Materials Research Society	12 国際会議録 The Effect of a Threshold Failure Time on Electromigration Behavior of Copper Interconnects R.G. Filippi, J. Lloyd, P. Wang, A. Brendler, J. Poulin Electrochemical Society

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